Title:
POLYAMIDE IMIDE RESIN COMPOSITION AND COATING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/015998
Kind Code:
A1
Abstract:
A polyamide imide resin composition which contains a polar heterocyclic compound having a symmetrical molecular structure, a polyamide imide resin and a tetrafunctional epoxy resin, and wherein the content of the heterocyclic compound in the composition is 40% by mass or more.
Inventors:
SAITO YASUYUKI (JP)
Application Number:
PCT/JP2016/071151
Publication Date:
January 25, 2018
Filing Date:
July 19, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/18; C08G59/32; C08G59/44; C08L79/08
Domestic Patent References:
| WO2010038644A1 | 2010-04-08 |
Foreign References:
| JP2014205827A | 2014-10-30 | |||
| JP2008285660A | 2008-11-27 | |||
| JP2008208295A | 2008-09-11 | |||
| JP2013209960A | 2013-10-10 | |||
| JP2013004371A | 2013-01-07 | |||
| JPH03166260A | 1991-07-18 |
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
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