POLYAMIDE IMIDE RESIN, RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Title:

POLYAMIDE IMIDE RESIN, RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2021/045004

Kind Code:

A1

Abstract:

A polyamide imide resin which contains a structural unit (Ia) represented by formula (Ia) and a structural unit (IIa) represented by formula (IIa). In formula (Ia), each X independently represents a hydrogen atom or at least one substituent that is selected from the group consisting of a halogen atom, an alkyl group having from 1 to 9 carbon atoms, an alkoxy group having from 1 to 9 carbon atoms and a hydroxyalkyl group. In formula (IIa), each R independently represents a hydrogen atom or at least one substituent that is selected from the group consisting of an alkyl group having from 1 to 9 carbon atoms, an alkoxy group having from 1 to 9 carbon atoms and a halogen atom; and n represents an integer from 1 to 6.

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Inventors:

HASHIMOTO GAKU (JP)
TAKEMORI DAICHI (JP)
SATOH EIICHI (JP)
SATO MIZUKI (JP)

Application Number:

PCT/JP2020/032883

Publication Date:

March 11, 2021

Filing Date:

August 31, 2020

Export Citation:

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Assignee:

SHOWA DENKO MATERIALS CO LTD (JP)

International Classes:

C08G73/14; C08K5/00; C08L79/08; H01L23/29; H01L23/31

Foreign References:

JP2007077308A	2007-03-29
JP2005146118A	2005-06-09
JP2020007531A	2020-01-16
JP2013135061A	2013-07-08
JP2019163154A	2019-09-26

Other References: