Title:
POLYAMIDE RESIN COMPOSITE MATERIAL, AND PREPARATION METHOD THEREFOR AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/078571
Kind Code:
A1
Abstract:
Disclosed in the present invention are a polyamide resin composite material, and a preparation method therefor and the use thereof, which belong to the technical field of high polymer materials. The polyamide resin composite material comprises the following components in parts by weight: 20-60 parts of a polyamide resin, 5-60 parts of a white pigment, 1-40 parts of a filler, 0.5-2 parts of silicon dioxide, and 0-10 parts of a processing aid, wherein the average particle size of the silicon dioxide is 10-30 nm, and the pH value of the silicon dioxide is 4-5.5. In the polyamide resin composite material of the present invention, the surface energy of the composite material is effectively reduced by means of the synergistic effect of the nanoscale silicon dioxide having a specific pH value and the white pigment, such that the problem of glue overflow of an encapsulation adhesive is solved. The low-surface-energy polyamide resin composite material can be applied to an LED reflector cup.
Inventors:
JIANG ZHIQIANG (CN)
YAN KUN (CN)
YANG HUIXIN (CN)
LI JIANWEI (CN)
MAI JIEHONG (CN)
JIANG SUJUN (CN)
XU XIANJUN (CN)
YAN KUN (CN)
YANG HUIXIN (CN)
LI JIANWEI (CN)
MAI JIEHONG (CN)
JIANG SUJUN (CN)
XU XIANJUN (CN)
Application Number:
PCT/CN2023/124218
Publication Date:
April 18, 2024
Filing Date:
October 12, 2023
Export Citation:
Assignee:
KINGFA SCI & TECH CO LTD (CN)
ZHUHAI VANTEQUE SPECIALTY ENG PLASTICS CO LTD (CN)
ZHUHAI VANTEQUE SPECIALTY ENG PLASTICS CO LTD (CN)
International Classes:
C08L77/06; C08L23/06
Attorney, Agent or Firm:
YOGO PATENT AND TRADEMARK AGENCY LIMITED COMPANY (CN)
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