Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYAMIDE RESIN COMPOSITION, FILM COMPRISING SAME, AND LAMINATED POLYAMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2010/107131
Kind Code:
A1
Abstract:
A polyamide composition for films which comprises a polyamide resin, a vinylamide polymer, and a crosslinked poly(N-vinyllactam), and a film comprising the polyamide composition. The polyamide resin composition for films has a matte texture, is less yellowish, and has a satisfactory film appearance. The composition has a high water vapor permeability, is highly effective in smoking treatment, is capable of diminishing troubles such as filter clogging, and has excellent suitability for continuous production.

Inventors:
YAMAGUCHI YUTAKA (JP)
NAKAMURA KOUJI (JP)
Application Number:
PCT/JP2010/055146
Publication Date:
September 23, 2010
Filing Date:
March 17, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
UBE INDUSTRIES (JP)
YAMAGUCHI YUTAKA (JP)
NAKAMURA KOUJI (JP)
International Classes:
C08L77/00; A23B4/03; B32B27/34; C08J5/18; C08L39/06
Domestic Patent References:
WO2005046339A12005-05-26
Foreign References:
JP2006523254A2006-10-12
JPH1066846A1998-03-10
JP2006526546A2006-11-24
US7361392B22008-04-22
JP2002306059A2002-10-22
JPS58104940A1983-06-22
JPH03196822A1991-08-28
US7361392B22008-04-22
JP2002306059A2002-10-22
JP2005515501A2005-05-26
JPS5430027B11979-09-27
JPH0339087B21991-06-12
JPS6178808A1986-04-22
JPS6178809A1986-04-22
US2938017A1960-05-24
US3277066A1966-10-04
US3759880A1973-09-18
JPS5842201B21983-09-17
Other References:
POLYMER JOURNAL, vol. 17, no. 1, 1985, pages 143 - 152
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Atsushi Aoki (JP)
Download PDF: