Title:
POLYAMIDE RESIN COMPOSITION, FILM AND FILM LAMINATE COMPRISING SAME, AND PELLET MIXTURE
Document Type and Number:
WIPO Patent Application WO/2024/010008
Kind Code:
A1
Abstract:
Provided are: a polyamide resin composition, which can provide a film that does not have poor appearance arising from film gels and has excellent transparency, puncture strength, and pinhole resistance and which makes material recycling possible; and a film and a film laminate that utilize the polyamide resin composition. A polyamide resin composition comprising, with respect to 100 mass% of the polyamide resin composition, 70-95 mass% of an aliphatic polyamide resin (A), 5-30 mass% of an ethylene/3-8 carbon α-olefin copolymer (B) that has functional groups, and 0-5 mass% of another component (C), wherein: the ratio of the number of methylene groups to the number of amide groups in the aliphatic polyamide resin (A) is 3-11; and when the number average molecular weight and weight average molecular weight by GPC measurement of the polyamide resin composition are Mn and Mw, respectively, Mn is 25,000-46,000, and Mw/Mn is 1.5-3.0.
Inventors:
FUJINO HIROSHI (JP)
ONO KEITAROU (JP)
YABU NAOYASU (JP)
YAMASHITA ATSUSHI (JP)
ONO KEITAROU (JP)
YABU NAOYASU (JP)
YAMASHITA ATSUSHI (JP)
Application Number:
PCT/JP2023/024827
Publication Date:
January 11, 2024
Filing Date:
July 04, 2023
Export Citation:
Assignee:
UBE CORP (JP)
International Classes:
C08L77/00; B29B7/00; B29C48/00; B29C48/28; B29C48/395; B29C48/80; B29C48/86; B32B27/32; B32B27/34; C08J5/18
Domestic Patent References:
| WO2021131814A1 | 2021-07-01 | |||
| WO2017094564A1 | 2017-06-08 | |||
| WO2022039169A1 | 2022-02-24 |
Foreign References:
| JP2017509763A | 2017-04-06 | |||
| JP2000109685A | 2000-04-18 | |||
| JP2022091118A | 2022-06-20 | |||
| JP2019038938A | 2019-03-14 | |||
| JP2018203804A | 2018-12-27 | |||
| JP2002254581A | 2002-09-11 | |||
| JP2023050581A | 2023-04-11 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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