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Title:
POLYAMIDE RESIN COMPOSITION FOR INJECTION MOULDING
Document Type and Number:
WIPO Patent Application WO/2011/115031
Kind Code:
A1
Abstract:
Provided is a polyamide resin composition comprising an amorphous polyamide resin (A) that contains alicyclic groups but not aromatic groups, a terpene phenolic resin (B), and modified cross section glass fibres (C) that have a modified cross section with a long diameter to short diameter ratio of 1.5 to 10. The polyamide resin composition for injection moulding has (i) a surface glass transition temperature of 125-160 °C, and (ii) a melt viscosity at 285 °C of 1000-2000 Pa⋅s at a shear velocity of 12.2 sec-1 and 100-350 Pa⋅s at a shear velocity of 1216 sec-1. The polyamide resin composition is exceptionally stable during production, has low variation in mechanical strength, thin wall mouldability, dimensional stability, etc., can minimise burr development in thin wall injection moulding products, and furthermore, has excellent coating adhesion.

Inventors:
FUJII,Yasuto (1-1Katata 2-chome,Ohtsu-sh, Shiga 92, 〒5200292, JP)
藤井 泰人 (〒92 滋賀県大津市堅田二丁目1番1号 東洋紡績株式会社 内 Shiga, 〒5200292, JP)
Application Number:
JP2011/055884
Publication Date:
September 22, 2011
Filing Date:
March 14, 2011
Export Citation:
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Assignee:
TOYO BOSEKI KABUSHIKI KAISHA (2-8Dojima Hama 2-chome, Kita-kuOsaka-sh, Osaka 30, 〒5308230, JP)
東洋紡績株式会社 (〒30 大阪府大阪市北区堂島浜二丁目2番8号 Osaka, 〒5308230, JP)
FUJII,Yasuto (1-1Katata 2-chome,Ohtsu-sh, Shiga 92, 〒5200292, JP)
International Classes:
C08L77/00; C08K7/14; C08K9/06; C08L65/00
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Claims: