Title:
POLYAMIDE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/126038
Kind Code:
A1
Abstract:
Disclosed is a polyamide resin composition which is characterized by containing 0.01-50 parts by mass of cellulose fibers having an average fiber diameter of 10 μm or less per 100 parts by mass of a polyamide resin. Also disclosed is a method for producing a polyamide resin composition, which is characterized by mixing a monomer that constitutes a polyamide resin and an aqueous dispersion of cellulose fibers having an average fiber diameter of 10 μm or less and carrying out a polymerization reaction.
Inventors:
NAKAI, Miho (())
中井 美穂 (())
中井 美穂 (())
Application Number:
JP2011/058678
Publication Date:
October 13, 2011
Filing Date:
April 06, 2011
Export Citation:
Assignee:
UNITIKA LTD. (50 Higashi-Hommachi 1-chome, Amagasaki-shi Hyogo, 24, 〒6600824, JP)
ユニチカ株式会社 (〒24 兵庫県尼崎市東本町１丁目５０番地 Hyogo, 〒6600824, JP)
NAKAI, Miho (())
ユニチカ株式会社 (〒24 兵庫県尼崎市東本町１丁目５０番地 Hyogo, 〒6600824, JP)
NAKAI, Miho (())
International Classes:
C08L77/00; C08L1/02
Attorney, Agent or Firm:
MORIMOTO INT'L PATENT OFFICE (ORIX Hommachi Bldg, 4th Floor 4-1, Nishi-Honmachi 1-chome, Nishi-ku, Osaka-sh, Osaka 05, 〒5500005, JP)
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