POLYAMIDE RESIN COMPOSITION AND MOLDED BODY FORMED BY MOLDING SAME

Title:

POLYAMIDE RESIN COMPOSITION AND MOLDED BODY FORMED BY MOLDING SAME

Document Type and Number:

WIPO Patent Application WO/2018/143110

Kind Code:

A1

Abstract:

Provided is a polyamide resin composition characterized by containing a semi-aromatic polyamide (A) having a melting point of 280-320°C, an aliphatic polyamide (B), 5-30 mass% of a metal phosphinate salt (C), 5-60 mass% of a reinforcing material (D), 0.1-8 mass% of a metal carbonate salt (E), and 0.01-3 mass% of a fatty acid barium salt (F), wherein the sum content of (A) and (B) is 30-85 mass%, and the mass ratio (A/B) of (A) to (B) is 90/10-40/60.

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Inventors:

MASAKI TATSUNORI (JP)
KAMIKAWA HIROO (JP)
MII JUNICHI (JP)

Application Number:

PCT/JP2018/002607

Publication Date:

August 09, 2018

Filing Date:

January 29, 2018

Export Citation:

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Assignee:

UNITIKA LTD (JP)

International Classes:

C08L77/00; C08K3/26; C08K5/098; C08K5/24; C08K5/5313

Domestic Patent References:

WO2017082231A1

2017-05-18

Foreign References:

JP2012528904A	2012-11-15
JP2014521765A	2014-08-28
JP2007031611A	2007-02-08
JP2013241624A	2013-12-05
JP2011513540A	2011-04-28
JPH02214752A	1990-08-27
JPH05239343A	1993-09-17

Attorney, Agent or Firm:

MORIMOTO INT'L PATENT OFFICE (JP)

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