Title:
POLYAMIDE RESIN COMPOSITION, MOLDED BODY THEREOF, AND METHOD FOR MANUFACTURING LASER-WELDED BODY
Document Type and Number:
WIPO Patent Application WO/2019/160117
Kind Code:
A1
Abstract:
This polyamide resin composition contains: 30-89.9 parts by mass of a polyamide resin (A) having a melting point of at least 300°C; 0-45 parts by mass of a polyamide resin (B) having substantially no melting point; 0.1-5 parts by mass of a light-transmitting pigment (C); and 10-55 parts by mass of a fibrous filler (D) (the total amount of (A), (B), (C), and (D) is 100 parts by mass). The polyamide resin (A) contains at least a terephthalic acid-derived component unit. In a molded body of the polyamide resin composition, the corrected heat of fusion (ΔHR) is 10-70 J/g, and the transmittance of laser light having a wavelength of 940 nm is at least 15% at a thickness of 1.6 mm.
Inventors:
NISHINO KOHEI
HOTANI YOHEI
WASHIO ISAO
HOTANI YOHEI
WASHIO ISAO
Application Number:
PCT/JP2019/005694
Publication Date:
August 22, 2019
Filing Date:
February 15, 2019
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08L77/06; B29C65/16; C08K3/01; C08K7/02
Domestic Patent References:
| WO2017110372A1 | 2017-06-29 | |||
| WO2003085029A1 | 2003-10-16 |
Foreign References:
| JP2008266434A | 2008-11-06 | |||
| JP2012040715A | 2012-03-01 | |||
| JP2013199570A | 2013-10-03 | |||
| JP2011063795A | 2011-03-31 | |||
| JP2015058608A | 2015-03-30 | |||
| JP2003064262A | 2003-03-05 | |||
| US20170368762A1 | 2017-12-28 | |||
| JP2017002205A | 2017-01-05 | |||
| JP2004148800A | 2004-05-27 | |||
| JP2006273992A | 2006-10-12 | |||
| JP2018026310A | 2018-02-15 |
Other References:
See also references of EP 3753985A4
Attorney, Agent or Firm:
WASHIDA, Kimihito (JP)
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