Title:
POLYAMIDE RESIN COMPOSITION AND MOLDING
Document Type and Number:
WIPO Patent Application WO/2014/203606
Kind Code:
A1
Abstract:
This polyamide resin composition comprises: (A) a polyamide resin; (B) glass fibers having a carboxylic anhydride-containing unsaturated vinyl monomer compound on at least a portion of the surface; and (C) a copolymer containing a carboxylic anhydride-containing unsaturated vinyl monomer and for which the glass transition temperature (Tg) exceeds 0°C.
Inventors:
KAWAMURA TOMOYO (JP)
SAKUMA TERUAKI (JP)
TERADA KAZUNORI (JP)
SAKUMA TERUAKI (JP)
TERADA KAZUNORI (JP)
Application Number:
PCT/JP2014/060850
Publication Date:
December 24, 2014
Filing Date:
April 16, 2014
Export Citation:
Assignee:
ASAHI KASEI CHEMICALS CORP (JP)
International Classes:
C08L77/00; C08K7/14; C08K9/04; C08L23/08; C08L101/06
Domestic Patent References:
| WO2012093722A1 | 2012-07-12 |
Foreign References:
| JP2005232239A | 2005-09-02 | |||
| JP2005320370A | 2005-11-17 | |||
| JPH11226949A | 1999-08-24 | |||
| JP2002047412A | 2002-02-12 | |||
| JP2004300278A | 2004-10-28 | |||
| JP2007031505A | 2007-02-08 | |||
| JP2010270327A | 2010-12-02 | |||
| JP2011068874A | 2011-04-07 | |||
| JPS6176540A | 1986-04-19 | |||
| JP2006291118A | 2006-10-26 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Yoshiyuki Inaba (JP)
Yoshiyuki Inaba (JP)
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