POLYAMIDE RESIN COMPOSITION AND PROCESS FOR THE PREPARATION THEREOF

Title:

POLYAMIDE RESIN COMPOSITION AND PROCESS FOR THE PREPARATION THEREOF

Document Type and Number:

WIPO Patent Application WO/2000/012630

Kind Code:

A1

Abstract:

A polyamide resin composition comprising a polyamide resin and fibrous xonotlite, characterized in that the xonotlite content is 1 wt.% or above but below 10 wt.%, that the xonotlite has a BET specific surface area of 21 m?2¿/g or above as determined by the nitrogen adsorption method and a specific shape, and preferably that the crystallinity of the polyamide resin is 0.40 or above as represented by the formula: $g(D)H¿m?/{$g(D)H¿0?(1-W¿f?)} wherein $g(D)H¿m? is the heat of fusion of the polyamide resin composition as found under specific conditions; Wf is the weight fraction of the fibrous xonotlite in the composition; and $g(D)H¿0? is the heat of fusion of crystal of the polyamide resin. Moldings of the composition exhibit excellent physical properties by virtue of the speedy crystallization and excellent moldability of the composition and the high crystallinity of the polyamide resin, thus being widely usable as automobile materials, electrical and electronic components, parts of precision machines, wrapping materials and so on.

More Like This:

WO/2022/062247	TPU NON-SLIP GASKET AND MANUFACTURING METHOD THEREFOR
WO/2018/078500	ELASTOMERIC MATERIALS FOR COMPONENTS OF TYRES AND TYRES COMPRISING MODIFIED SILICATE FIBRES
WO/2002/086911	CONDUCTIVE, SILICONE-BASED COMPOSITIONS WITH IMPROVED INITIAL ADHESION AND REDUCED MICROVOIDING

Inventors:

TANAKA HIDEHO (JP)
WATANABE KUNIO (JP)

Application Number:

PCT/JP1998/003797

Publication Date:

March 09, 2000

Filing Date:

August 27, 1998

Export Citation:

Click for automatic bibliography generation Help

Assignee:

UBE INDUSTRIES (JP)
TANAKA HIDEHO (JP)
WATANABE KUNIO (JP)

International Classes:

C08K7/10; (IPC1-7): C08L77/00; C08K7/10

Foreign References:

JPH07216133A	1995-08-15
JPH02500917A	1990-03-29

Other References:

"POLYAMIDE RESIN HANDBOOK, PASSAGE", POLYAMIDE RESIN HANDBOOK, XX, XX, 30 January 1988 (1988-01-30), XX, pages 79 + 102, XP002926666

Attorney, Agent or Firm:

Tsukuni, Hajime (Toranomon 1-chome Minato-ku Tokyo, JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: BLENDS OF POLY(1,3-PROPYLENE 2,6-NAPHTHALATE)

Next Patent: USE OF TANNIC ACID AS SETTING INHIBITOR FOR ASPHALT EMULSIONS