Title:
POLYAMIDE RESIN COMPOSITION FOR SLIDING COMPONENTS, AND SLIDING COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/060030
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polyamide resin composition which has excellent moldability and thermal stability, and which is suitable for use in molding of a sliding component that requires excellent sliding characteristics, especially excellent wear resistance with the intermediary of particles (hereinafter also referred to as dust) having high hardness and excellent sliding stability. A polyamide resin composition for sliding components according to the present invention contains: (A) a crystalline polyamide resin; (B) a modified polyolefin resin having a reactive functional group that is reactive with an end group and/or a main chain amide group of the polyamide resin (A); (C) a thermoplastic elastomer having a reactive functional group that is reactive with an end group and/or a main chain amide group of the polyamide resin (A); (D) an antioxidant; and (E) a mold release agent. With respect to this polyamide resin composition for sliding components, the modified polyolefin resin (B) and the thermoplastic elastomer (C) are dispersed in the form of domains having a particle diameter of 5 μm or less in a matrix of the polyamide resin (A).
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Inventors:
IWAMURA KAZUKI (JP)
YOSHIMURA NOBUHIRO (JP)
YOSHIMURA NOBUHIRO (JP)
Application Number:
PCT/JP2020/034549
Publication Date:
April 01, 2021
Filing Date:
September 11, 2020
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08K5/00; C08K5/10; C08L13/00; C08L23/26; C08L77/00
Domestic Patent References:
| WO2008075699A1 | 2008-06-26 |
Foreign References:
| JP2012184280A | 2012-09-27 | |||
| JPH08157714A | 1996-06-18 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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