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Patent Searching and Data


Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/005204
Kind Code:
A1
Abstract:
Disclosed is a polyamide resin composition that has a high elastic modulus, favorable gas barrier properties, low water absorption, and excellent flexibility and transparency. The polyamide resin composition is characterized by containing 1-40 masses of at least one copolymer polyamide (B) selected from the group consisting of the belowmentioned B-1 to B-3 for every 100 masses of a polyamide resin (A) of which at least 70 mol% of the diamine constituent units are derived from xylenediamine, and at least 50 mol% of the dicarboxylic acid constituent units are derived from sebacic acid. (B-1): Copolymer polyamide 6/66/12. (B-2) Copolymer polyamide 6/66/11. (B-3) Polyether copolymer polyamide configured from polyamide 12 units or polyamide 11 units, and polyether units.

Inventors:
MITADERA JUN (JP)
KUROKAWA MASASHI (JP)
TAKANO TAKAHIRO (JP)
Application Number:
PCT/JP2011/065260
Publication Date:
January 12, 2012
Filing Date:
July 04, 2011
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
MITADERA JUN (JP)
KUROKAWA MASASHI (JP)
TAKANO TAKAHIRO (JP)
International Classes:
C08L77/06; C08G69/26; C08K5/29
Foreign References:
JP2006297894A2006-11-02
JP2008133455A2008-06-12
JPS5927948A1984-02-14
JPS63137955A1988-06-09
JPH1171455A1999-03-16
JPH03106646A1991-05-07
JP2011105822A2011-06-02
JPH04198329A1992-07-17
Other References:
See also references of EP 2570459A4
Attorney, Agent or Firm:
KAWABI Kenji (JP)
Kenji Kawabi (JP)
Download PDF:
Claims: