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Patent Searching and Data


Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/115699
Kind Code:
A1
Abstract:
A polyamide resin composition which, even when kept in contact with a liquid chemical for a long time under high-temperature conditions, suffers no decrease in mechanical strength and has high durability and which is suitable for forming tubes, connectors, and the like for conveying various liquid chemicals. The polyamide resin composition is obtained by compounding a polyamide, a monocarbodiimide, and a polycarbodiimide.

Inventors:
TAZAKI, Go (41, Miyukigaoka, Tsukuba-sh, Ibaraki 41, 〒3050841, JP)
HASEGAWA, Toshiaki (41, Miyukigaoka, Tsukuba-sh, Ibaraki 41, 〒3050841, JP)
Application Number:
JP2016/088062
Publication Date:
July 06, 2017
Filing Date:
December 21, 2016
Export Citation:
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Assignee:
KURARAY CO., LTD. (1621, Sakazu Kurashiki-sh, Okayama 01, 〒7100801, JP)
International Classes:
C08L77/00; C08K5/29; C08L21/00; C08L79/00; F16L11/06
Foreign References:
US20070066727A12007-03-22
JP2013040346A2013-02-28
JP2009035731A2009-02-19
JP2001302910A2001-10-31
JPS63179961A1988-07-23
JP2011038607A2011-02-24
JP2014012771A2014-01-23
JP2012136579A2012-07-19
JP2000281887A2000-10-10
JP2014037465A2014-02-27
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (OHTANI PATENT OFFICE, Toranomon ES Bldg. 7F. 25-2, Toranomon 3-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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