Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/085472
Kind Code:
A1
Abstract:
The purpose of the present invention is to concurrently achieve low-temperature toughness by the blow-molded article; blow moldability for the blow-molded article, i.e., mold transferability, inhibition of scorching, inhibition of surface unevenness, drawdown behavior, and dimensional stability; and blistering resistance. A polyamide resin composition according to the present invention comprises 60-85 mass% of a polyamide resin (A), 5-20 mass% of an olefinic ionomer (B), and 5-20 mass% of an impact-resistant material (C) in 100 mass% of the polyamide resin composition, wherein at least 20 mass% of an aliphatic copolymer polyamide (A-1) is contained in 100 mass% of the polyamide resin (A).
Inventors:
HIROKI TETSURO (JP)
YASUI TETSUYA (JP)
YASUI TETSUYA (JP)
Application Number:
PCT/JP2020/040426
Publication Date:
May 06, 2021
Filing Date:
October 28, 2020
Export Citation:
Assignee:
UBE INDUSTRIES (JP)
International Classes:
C08K5/00; C08L23/26; C08L77/00
Domestic Patent References:
| WO2019117072A1 | 2019-06-20 | |||
| WO2019054109A1 | 2019-03-21 |
Foreign References:
| JP2007204675A | 2007-08-16 | |||
| JP2007204674A | 2007-08-16 | |||
| JP2013249363A | 2013-12-12 | |||
| JP2012092290A | 2012-05-17 | |||
| JP2001011305A | 2001-01-16 | |||
| JP2008503631A | 2008-02-07 | |||
| JP2013203869A | 2013-10-07 | |||
| JP2020041132A | 2020-03-19 | |||
| JP2020117637A | 2020-08-06 | |||
| JP2007204675A | 2007-08-16 | |||
| JPH11245927A | 1999-09-14 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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