Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYAMIDE RESIN FILM AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2012/077473
Kind Code:
A1
Abstract:
A xylylenediamine-based polyamide resin monolayer film which can be thinly rolled is provided. The polyamide film is derived from xylylenediamine having diamine structural units with a mole percent of at least 70, comprises a polyamide resin obtained by the polycondensation of dicarboxylic acid, has a film thickness of 10 to 50 μm, and graining is conducted on the surface thereof.

Inventors:
MITADERA JUN (JP)
Application Number:
PCT/JP2011/076502
Publication Date:
June 14, 2012
Filing Date:
November 17, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
MITADERA JUN (JP)
International Classes:
C08J5/18; B29C59/04; C08G69/26; C08K5/29; C08L77/06
Foreign References:
JP2007119782A2007-05-17
JP2008080690A2008-04-10
JP2010000707A2010-01-07
JP2008133455A2008-06-12
JP2008094049A2008-04-24
JP2009279927A2009-12-03
JP2010248418A2010-11-04
JPH0995546A1997-04-08
Other References:
See also references of EP 2650322A4
Attorney, Agent or Firm:
KAWABI Kenji (JP)
Kenji Kawabi (JP)
Download PDF:
Claims: