POLYAMIDE RESIN AND METHOD FOR MANUFACTURING SAME

Title:

POLYAMIDE RESIN AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2015/080436

Kind Code:

A1

Abstract:

A method for manufacturing a polyamide resin, according to the present invention, comprises the steps of: obtaining a low-order condensate in a solid state through polycondensation of dicarboxylic acid and diamine in the presence of a compound having a wt% of approximately 0.01 to 0.5 with respect to the total amount of the dicarboxylic acid and the diamine; and solid-state polymerizing the low-order condensate, wherein the dicarboxylic acid contains, with respect to the total amount of the dicarboxylic acid, approximately 70 mol% of aliphatic dicarboxylic acid having 9 to 12 carbon atoms, wherein the diamine contains, with respect to the total amount of the diamine, approximately 50 mol% of diamine represented by previously indicated chemical formula 1, wherein the range of the maximum temperature of the polycondensation reaction is approximately 200 to 230°C, and the maximum reaction temperature of the solid-state polymerization is approximately 170 to 230°C.

Inventors:

KANDA TOMOMICHI (JP)
SHIMODA TOMOAKI (JP)

Application Number:

PCT/KR2014/011267

Publication Date:

June 04, 2015

Filing Date:

November 21, 2014

Export Citation:

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Assignee:

SAMSUNG SDI CO LTD (KR)

International Classes:

C08G69/28; C08G69/30; C08K3/32

Foreign References:

KR20130069388A	2013-06-26
JP2009203422A	2009-09-10
JP2004352833A	2004-12-16
KR20120040736A	2012-04-27
KR20130073773A	2013-07-03
JP2009203422A	2009-09-10

Other References: