POLYAMIDE RESIN AND METHOD FOR MOLDING SAME - MITSUBISHI GAS CHEMICAL CO

Title:

POLYAMIDE RESIN AND METHOD FOR MOLDING SAME

Document Type and Number:

WIPO Patent Application WO/2012/070377

Kind Code:

A1

Abstract:

Provided is a polyamide resin having high heat resistance, excellent moldability and excellent mechanical properties. A polyamide resin comprising a diamine unit which contains 70 mol% or more of a xylylene diamine unit comprising 50-95 mol% of paraxylylene diamine and 50-5 mol% of metaxylylene diamine and a dicarboxylic acid unit which contains 70 mol% or more of a linear aliphatic dicarboxylic acid unit comprising 50-100 mol% of adipic acid and 0 mol% or greater but less than 50 mol% of sebacic acid or another linear aliphatic carboxylic acid, wherein the polyamide resin is characterized in that the molar ratio of the reacted diamine unit to the reacted dicarboxylic acid unit ((the molar number of the reacted diamine units)/(the molar number of the reacted dicarboxylic acid units)) is less than 0.994 and the polyamide resin has a number average molecular weight of 10,000-25,000 and a melting point of 285˚C or higher.

Inventors:

OGURO HATSUKI (JP)
MITADERA JUN (JP)
KUWAHARA HISAYUKI (JP)

Application Number:

PCT/JP2011/075658

Publication Date:

May 31, 2012

Filing Date:

November 08, 2011

Export Citation:

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Assignee:

MITSUBISHI GAS CHEMICAL CO (JP)
OGURO HATSUKI (JP)
MITADERA JUN (JP)
KUWAHARA HISAYUKI (JP)

International Classes:

C08G69/26

Domestic Patent References:

WO2011065347A1	2011-06-03
WO2010032692A1	2010-03-25

Foreign References:

JP2010059366A	2010-03-18
JPH08259691A	1996-10-08
JP2004002821A	2004-01-08
JP2003201399A	2003-07-18
JP2006257314A	2006-09-28
JP2008182172A	2008-08-07
JP2009099533A	2009-05-07
JP2009202567A	2009-09-10

Other References: