POLYAMIDE RESIN, MOLDED ARTICLE, METHOD FOR PRODUCING POLYAMIDE RESIN

Title:

POLYAMIDE RESIN, MOLDED ARTICLE, METHOD FOR PRODUCING POLYAMIDE RESIN

Document Type and Number:

WIPO Patent Application WO/2017/134946

Kind Code:

A1

Abstract:

Provided are a polyamide resin having an excellent appearance when made into a molded article as well as an excellent solder reflow property while maintaining a low water absorption rate, and a molded article and a method for producing a polyamide resin. A polyamide resin composed of structural units derived from a diamine and structural units derived from a dicarboxylic acid, 70 mol% or more of the structural units derived from the diamine being derived from 1,4-bis(aminomethyl)cyclohexane, the cis:trans ratio of the 1,4-bis(aminomethyl)cyclohexane being 35:65-0:100, and 70 mol% or more of the structural units derived from a dicarboxylic acid being derived from a C8-12 α, ω-linear aliphatic dicarboxylic acid, wherein the polyamide resin includes phosphorus atoms in a proportion of 20-100 mass ppm, and calcium atoms are included such that the molar ratio of phosphorus atoms:calcium atoms is 1:0.3-0.7.

Inventors:

OGURO HATSUKI (JP)
KATO TOMONORI (JP)

Application Number:

PCT/JP2016/087554

Publication Date:

August 10, 2017

Filing Date:

December 16, 2016

Export Citation:

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Assignee:

MITSUBISHI GAS CHEMICAL CO (JP)

International Classes:

C08G69/26; C08L77/06

Domestic Patent References:

WO2012014772A1	2012-02-02
WO2010137703A1	2010-12-02

Foreign References:

JP2015017178A	2015-01-29
JP2014177548A	2014-09-25
JP2014111754A	2014-06-19

Other References: