Title:
POLYAMIDE RESIN MOLDING MATERIAL FOR FILM AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2006/038507
Kind Code:
A1
Abstract:
A polyamide resin molding material for films which is obtained by mixing (A) 90-99 parts by weight of polyamide resin pellets, (B) 10-1 part by weight of a masterbatch comprising a polyamide resin and, compound therewith, 2-8 wt.% inorganic particles and 1-5 wt.% bisamide compound, and (C) 0.005-0.1 part by weight of a bisamide compound powder, the sum of (A) and (B) being 100 parts by weight. The polyamide resin molding material for films is suitable for use in producing a polyamide resin film which is excellent in transparency, slip properties, and printability and which, even when having been formed continuously, is less apt to have appearance defects such as die lines or fisheyes.
Inventors:
OOYAMA HAJIME (JP)
TSUNODA MORIO (JP)
TSUNODA MORIO (JP)
Application Number:
PCT/JP2005/017852
Publication Date:
April 13, 2006
Filing Date:
September 28, 2005
Export Citation:
Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
OOYAMA HAJIME (JP)
TSUNODA MORIO (JP)
OOYAMA HAJIME (JP)
TSUNODA MORIO (JP)
International Classes:
C08L77/00; C08J3/22; C08K3/00; C08K5/20; C08K9/06
Foreign References:
| JP2000309702A | 2000-11-07 | |||
| JP2002348465A | 2002-12-04 | |||
| JPH06340807A | 1994-12-13 |
Attorney, Agent or Firm:
Okada, Kazuhiko (6F Kudan Kangyo Bldg., 10-1, Kudan-Kita 1-chom, Chiyoda-ku Tokyo 73, JP)
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