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Title:
POLYAMIDE RESIN AND MOULDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2018/074234
Kind Code:
A1
Abstract:
Provided are: an amorphous polyamide resin which exhibits excellent Charpy impact strength and excellent heat aging resistance; and a moulded article which includes said polyamide resin. The amorphous polyamide resin includes diamine-derived structural units and dicarboxylic acid-derived structural units. At least 70 mol% of the diamine-derived structural units are derived from 1,4-bis(aminomethyl)cyclohexane. The molar ratio (cis/trans) of cis forms to trans forms in the 1,4-bis(aminomethyl)cyclohexane constituting the diamine-derived structural units is in the range of 90/10 to 20/80. The dicarboxylic acid-derived structural units include structural units derived from isophthalic acid, and structural units derived from a C8-12 linear aliphatic dicarboxylic acid, and includes substantially no structural units derived from terephthalic acid.

Inventors:
YAMANAKA MASAKI (JP)
KATO TOMONORI (JP)
OGURO HATSUKI (JP)
TSUNAKA NOBUHIDE (JP)
Application Number:
PCT/JP2017/036119
Publication Date:
April 26, 2018
Filing Date:
October 04, 2017
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G69/26; C08J5/00
Domestic Patent References:
WO2011132456A12011-10-27
WO2012014772A12012-02-02
WO2014156701A12014-10-02
WO2017033746A12017-03-02
WO2016208272A12016-12-29
Foreign References:
US20140127440A12014-05-08
JP2002138198A2002-05-14
JP2014111758A2014-06-19
JP2015017178A2015-01-29
Attorney, Agent or Firm:
SIKS & CO. (JP)
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