Title:
POLYAMIDE SOLUTION FOR PRODUCTION OF SENSOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2015/182655
Kind Code:
A1
Abstract:
The present disclosure relates to one embodiment of a method for producing a sensor element, which comprises the following steps (A) and (B).
(A) A step for forming a polyamide film on a supporting material by applying a polyamide solution onto the supporting material.
(B) A step for forming a sensor element on the surface of the polyamide film.
In this connection, the supporting material or the surface of the supporting material is a glass or silicon wafer, and a polyamide in the polyamide solution has constituent units represented by general formulae (I) and (II).
Inventors:
KAWASAKI RITSUYA
MAETANI TAKEHIKO
KATAYAMA TOSHIHIKO
OKADA JUN
UMEDA HIDEO
SUN LIMIN
JING JIAOKAI
ZHANG DONG
HARRIS FRANK W
MAETANI TAKEHIKO
KATAYAMA TOSHIHIKO
OKADA JUN
UMEDA HIDEO
SUN LIMIN
JING JIAOKAI
ZHANG DONG
HARRIS FRANK W
Application Number:
PCT/JP2015/065240
Publication Date:
December 03, 2015
Filing Date:
May 27, 2015
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
AKRON POLYMER SYSTEMS INC (US)
AKRON POLYMER SYSTEMS INC (US)
International Classes:
H01L27/14; C08L77/06
Domestic Patent References:
WO2009154263A1 | 2009-12-23 |
Foreign References:
JP2014508851A | 2014-04-10 | |||
JP2014025038A | 2014-02-06 | |||
JP2014031452A | 2014-02-20 | |||
JP2010027767A | 2010-02-04 | |||
JP2014511920A | 2014-05-19 |
Attorney, Agent or Firm:
IKEUCHI SATO & PARTNER PATENT ATTORNEYS (JP)
Patent business corporation Ikeuchi and Sato and partners (JP)
Patent business corporation Ikeuchi and Sato and partners (JP)
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