Title:
POLYAMIDE THERMOPLASTIC ELASTOMER COMPOSITION AND MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2015/083819
Kind Code:
A1
Abstract:
The present invention relates to: a rubber composition [X] containing a polyamide [I] of 30-100 mol% terephthalic acid structural units having a melting point of 220-290°C, an ethylene-α-olefin-unconjugated polyene copolymer rubber [II] containing ethylene, α-olefin having 3-20 carbon atoms, and unconjugated polyene structural units, and an olefin polymer [III] containing 0.3-5.0 mass% functional group structural units; and a polyamide thermoplastic elastomer composition [Y] dynamically crosslinked by a phenolic resin crosslinking agent [IV] ([I]-[IV] are a total of 100 mass%).
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Inventors:
EBATA HIROKI (JP)
ENOMOTO TATSUYA (JP)
WASHIO ISAO (JP)
KAGEYAMA FUMIO (JP)
TAKEISHI ATSUSHI (JP)
ISHII YUJI (JP)
AMANO AKINORI (JP)
ENOMOTO TATSUYA (JP)
WASHIO ISAO (JP)
KAGEYAMA FUMIO (JP)
TAKEISHI ATSUSHI (JP)
ISHII YUJI (JP)
AMANO AKINORI (JP)
Application Number:
PCT/JP2014/082224
Publication Date:
June 11, 2015
Filing Date:
December 05, 2014
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08J3/24; C08L23/16; C08L23/26; C08L61/06; C08L77/06
Domestic Patent References:
| WO2006003973A1 | 2006-01-12 | |||
| WO2005102694A1 | 2005-11-03 |
Foreign References:
| JPS6341554A | 1988-02-22 | |||
| JP2003096245A | 2003-04-03 | |||
| JP2001507060A | 2001-05-29 | |||
| JPH08231770A | 1996-09-10 | |||
| JP2011148887A | 2011-08-04 | |||
| JP2004217698A | 2004-08-05 | |||
| JP2001173672A | 2001-06-26 | |||
| JP2012224085A | 2012-11-15 | |||
| JP2013095802A | 2013-05-20 | |||
| JP2010241897A | 2010-10-28 | |||
| US4311628A | 1982-01-19 | |||
| US2972600A | 1961-02-21 | |||
| US3287440A | 1966-11-22 |
Other References:
See also references of EP 3078701A4
Attorney, Agent or Firm:
MIYAZAKI, Teruo et al. (JP)
Akio Miyazaki (JP)
Akio Miyazaki (JP)
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