Title:
POLYARYLENE SULFIDE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2007/052727
Kind Code:
A1
Abstract:
Disclosed is a polyarylene sulfide composition having excellent thermal conductivity, dimensional stability, heat resistance and low gas generation. This polyarylene sulfide composition is useful for electrical and/or electronic components or applications such as automobile electrical components. Specifically disclosed is a polyarylene sulfide composition containing a polyarylene sulfide (a), a metal silicon powder (b) and a fibrous filler (c). Preferably, this polyarylene sulfide composition further contains a mold release agent (d) and at least one thermal conductive filler (e) selected from the group consisting of a scale-like boron nitride powder (e1) having a hexagonal structure, a coated magnesium oxide powder (e2) which is coated with a double oxide of silicon and magnesium and/or a double oxide of aluminum and magnesium, a high-purity magnesite powder (e3) which is composed of a magnesite mainly containing magnesium carbonate and having a magnesium carbonate content of 98-99.999% by weight, and graphite (e4).
Inventors:
TANAKA YASUMI
MUNETO TOSHIHIKO
MUNETO TOSHIHIKO
Application Number:
PCT/JP2006/321914
Publication Date:
May 10, 2007
Filing Date:
November 01, 2006
Export Citation:
Assignee:
TOSOH CORP (JP)
TANAKA YASUMI
MUNETO TOSHIHIKO
TANAKA YASUMI
MUNETO TOSHIHIKO
International Classes:
C08L81/02; C08K3/00; C08K3/34; C08K7/06; C08L91/06
Domestic Patent References:
WO2003029352A1 | 2003-04-10 |
Foreign References:
JPH1060277A | 1998-03-03 | |||
JPH02272063A | 1990-11-06 | |||
JP2005162918A | 2005-06-23 | |||
JP2004137401A | 2004-05-13 | |||
JPH0433958A | 1992-02-05 | |||
JP2002129015A | 2002-05-09 | |||
JP2004137401A | 2004-05-13 | |||
JP2004027177A | 2004-01-29 | |||
JP2005320716A | 2005-11-17 | |||
JP2006105219A | 2006-04-20 |
Other References:
See also references of EP 1953194A4
Attorney, Agent or Firm:
OGURI, Shohei et al. (7-13 Nishi-Shimbashi 1-chom, Minato-ku Tokyo 03, JP)
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