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Title:
POLY(ARYLENE SULFIDE) RESIN COMPOSITION AND INSERT-MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2018/198850
Kind Code:
A1
Abstract:
[Problem] To provide a poly(arylene sulfide) resin composition and an insert-molded article using the resin composition which exhibit excellent impact resistance at high and low temperatures and low warpage. [Solution] This poly(arylene sulfide) resin composition contains a poly(arylene sulfide) resin A, a fibrous inorganic filler B1 having an aspect ratio, which is the ratio between the major axis and the minor axis of a cross section perpendicular to the longitudinal direction, of 3.0 or more, a non-fibrous inorganic filler B2, and an olefin copolymer C containing constituent units derived from an α-olefin and constituent units derived from a glycidyl ester of an α,β-unsaturated acid. The mass ratio B1/B2 of the fibrous inorganic filler B1 and the non-fibrous inorganic filler B2 is more than 1.0. The poly(arylene sulfide) resin composition contains a fibrous inorganic filler B3 in an amount of no more than 50 parts by mass relative to 100 parts by mass of the poly(arylene sulfide) resin A, the fibrous inorganic filler B3 having an aspect ratio, which is the ratio between the major axis and the minor axis of a cross section perpendicular to the longitudinal direction, of 2.0 or less.

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JPH02229858RESIN COMPOSITION FOR SEALING ELECTRONIC PARTS AND SEALED ELECTRONIC PARTS
JPH1171514THERMOPLASTIC RESIN COMPOSITION
JPS6327559POLYARYLENE SULFIDE INJECTION MOLDING COMPOUND
Inventors:
OHNISHI KATSUHEI (JP)
KANEZUKA TATSUYA (JP)
Application Number:
PCT/JP2018/015670
Publication Date:
November 01, 2018
Filing Date:
April 16, 2018
Export Citation:
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Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08L81/02; B29C45/14; B29C45/26; C08K3/26; C08K3/40; C08K7/04; C08L63/00
Domestic Patent References:
WO2014103814A12014-07-03
WO2016153048A12016-09-29
WO2015146718A12015-10-01
Foreign References:
JP2016535147A2016-11-10
JP2016069459A2016-05-09
JP2015101628A2015-06-04
JP2005161693A2005-06-23
JPH02173047A1990-07-04
JP2017101167A2017-06-08
JP2017088690A2017-05-25
JP2017088691A2017-05-25
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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