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Patent Searching and Data


Title:
POLYARYLENE SULFIDE RESIN COMPOSITION AND METHOD FOR REDUCING DIE-ADHERING SUBSTANCES USING SAME
Document Type and Number:
WIPO Patent Application WO2017010364
Kind Code:
A1
Abstract:
Provided are a polyarylene sulfide resin composition which allows significant reduction in die-adhering substances during molding not only in a gas vent but also in a cavity even when injection molding is performed at a high die temperature within the range of 130-180°C, and a method for reducing die-adhering substances using the polyarylene sulfide resin composition. The polyarylene sulfide resin composition according to the present invention contains (A) a polyarylene sulfide resin, (B) an epoxy group-containing olefin copolymer, and (C) an antioxidant, wherein the antioxidant (C) contains a phenol-based antioxidant, and does not contain a thioether-based antioxidant or a phosphorus-based antioxidant.

Inventors:
TACHIBORI RYOSUKE (JP)
Application Number:
PCT/JP2016/069984
Publication Date:
January 19, 2017
Filing Date:
July 06, 2016
Export Citation:
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Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08L81/02; B29C45/00; B29C45/34; C08J5/00; C08K5/13; C08L23/08
Foreign References:
JP2011173946A2011-09-08
JP2008202781A2008-09-04
JPH07157661A1995-06-20
JPH0368656A1991-03-25
JPH11100506A1999-04-13
JPH10279802A1998-10-20
JP2002226706A2002-08-14
JP2002226604A2002-08-14
JP2002226707A2002-08-14
JPH04332735A1992-11-19
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
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