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Title:
POLY(ARYLENE SULFIDE) RESIN COMPOSITION AND MOLDED OBJECT THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/033279
Kind Code:
A1
Abstract:
A molded poly(arylene sulfide) resin object which includes a poly(arylene sulfide) resin, is excellent in terms of adhesion to epoxy resins and thermal shock resistance, and has few burrs; and a poly(arylene sulfide) resin composition capable of giving the molded object. More specifically, the poly(arylene sulfide) resin composition comprises a poly(arylene sulfide) resin (A), a poly(amide ether) resin (B), and an epoxy resin (C) as essential components, and is characterized in that the poly(amide ether) resin (B) has a flexural modulus of 100 (MPa) or less. The molded object is one obtained by molding the poly(arylene sulfide) resin composition.

Inventors:
UCHIGATA MASANORI (JP)
KUNISHIGE MASASHI (JP)
SHIMAYA TAKU (JP)
Application Number:
PCT/JP2015/073828
Publication Date:
March 02, 2017
Filing Date:
August 25, 2015
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08L81/02; C08L63/02; C08L77/00
Foreign References:
JPH04332735A1992-11-19
JPH05178965A1993-07-20
JPS63308A1988-01-05
JPH041266A1992-01-06
JPH04239562A1992-08-27
JPH05194852A1993-08-03
JPS6469657A1989-03-15
Attorney, Agent or Firm:
KONO Michihiro (JP)
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