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Title:
POLY(ARYLENE SULFIDE) RESIN COMPOSITION, MOLDED ARTICLE, COMPOSITE MOLDED ARTICLE, AND METHODS RESPECTIVELY FOR PRODUCING SAID PRODUCTS
Document Type and Number:
WIPO Patent Application WO/2019/208374
Kind Code:
A1
Abstract:
Provided are: a composite molded article comprising a molded article which is produced from a poly(arylene sulfide) resin composition and can exhibit excellent epoxy adhesiveness even when being subjected to an annealing treatment and a cured article produced from a curable resin composition containing an epoxy resin, wherein the molded article and the cured article are bonded to each other; and a method for producing the composite molded article. Also provided are: a poly(arylene sulfide) resin composition which can provide the composite molded article; a molded article produced from the poly(arylene sulfide) resin composition; and methods respectively for producing the aforementioned products. More specifically provided are: a composite molded article comprising a molded article that is produced by molding a poly(arylene sulfide) resin composition and is subjected to an annealing treatment and a cured article produced from a curable resin composition containing an epoxy resin, wherein the poly(arylene sulfide) resin composition contains, as essential components, an olefin wax containing a carboxyl group and a carboxylic acid anhydride group and having an acid value of 65 to 150 [mgKOH/g] and an epoxy resin, and the molded article and the cured article are bonded to each other; a poly(arylene sulfide) resin composition for providing the composite molded article; a molded article; and methods respectively for producing the aforementioned products.

Inventors:
DEGUCHI Yuki (Chiba Plant 12, Yawata-kaigandori, Ichihara-sh, Chiba 85, 〒2908585, JP)
Application Number:
JP2019/016588
Publication Date:
October 31, 2019
Filing Date:
April 18, 2019
Export Citation:
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Assignee:
DIC CORPORATION (35-58, Sakashita 3-chome Itabashi-k, Tokyo 20, 〒1748520, JP)
International Classes:
B32B27/00; C08J7/00; C08L23/26; C08L63/00; C08L81/02
Domestic Patent References:
WO2018016411A12018-01-25
Foreign References:
JP2009256608A2009-11-05
JP2016166268A2016-09-15
JP2011020401A2011-02-03
Attorney, Agent or Firm:
OGAWA Shinji (7-20 Nihonbashi 3-chome, Chuo-k, Tokyo 33, 〒1038233, JP)
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