Title:
POLYARYLENE SULFIDE RESIN COMPOSITION, MOLDED ARTICLE, COMPOSITE MOLDED ARTICLE, AND METHOD FOR PRODUCING FOREGOING
Document Type and Number:
WIPO Patent Application WO/2019/208377
Kind Code:
A1
Abstract:
Provided are: a molded article of a polyarylene sulfide (PAS) resin composition having excellent epoxy adhesiveness and thermal shock resistance, in particular not only the thermal shock resistance addressed when a welded part is included but also the thermal shock resistance in the transverse (TD) direction; a PAS resin composition that can provide said molded article; and a composite molded article made by bonding said molded article and a cured product of a curable resin composition including an epoxy resin; and a method for producing the foregoing. More specifically, provided are: a PAS resin composition resulting from blending a PAS resin, an epoxy resin, an epoxy group-containing polyolefin, glass fibers, and glass flakes, wherein, with respect to 100 parts by mass of the PAS resin, the content of the glass fibers is 10-350 parts by mass and the content of the glass flakes is 1-250 parts by mass, the total content of epoxy group included in the epoxy resin and the epoxy resin-containing polyolefin is 25-300 μmol per 1 g of the PAS resin composition, and the epoxy equivalent of the epoxy resin is 100-2,400 g/eq.; a molded article thereof; a composite molded article thereof; and a method for producing the foregoing.
Inventors:
NISHIDA TAKUYA (JP)
DEGUCHI YUKI (JP)
UCHIGATA MASANORI (JP)
DEGUCHI YUKI (JP)
UCHIGATA MASANORI (JP)
Application Number:
PCT/JP2019/016595
Publication Date:
October 31, 2019
Filing Date:
April 18, 2019
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08L81/02; B32B27/00; B32B27/08; B32B27/38; C08K3/40; C08K7/00; C08K7/14; C08L63/00
Domestic Patent References:
| WO2014103814A1 | 2014-07-03 | |||
| WO2013141363A1 | 2013-09-26 |
Foreign References:
| JP2005306926A | 2005-11-04 | |||
| JP2009030030A | 2009-02-12 | |||
| JP2002129014A | 2002-05-09 | |||
| JP2002235002A | 2002-08-23 | |||
| JP2015066735A | 2015-04-13 | |||
| JP2014065774A | 2014-04-17 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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