Title:
POLY(BUTYLENE TEREPHTHALATE) RESIN COMPOSITION FOR MOLDED OBJECT FOR FUSION-BONDING OF POLYESTER ELASTOMER THERETO, AND MOLDED COMPOSITE OBJECT
Document Type and Number:
WIPO Patent Application WO/2018/159488
Kind Code:
A1
Abstract:
A poly(butylene terephthalate) resin composition for molded objects which are capable of bonding (fusion-bonding) by insert molding, have practical bonding strength even in stress concentration portions, and are for bonding of a polyester elastomer thereto. The poly(butylene terephthalate) resin composition comprises 20-96 mass% poly(butylene terephthalate) resin (A), 4-42 mass% polyester elastomer (B), 0-50 mass% copolyester resin (C), and 0-60 mass% inorganic filler (D).
Inventors:
KAMIYA MOTONOBU (JP)
HORIGUCHI SATORU (JP)
FUJII YASUTO (JP)
HORIGUCHI SATORU (JP)
FUJII YASUTO (JP)
Application Number:
PCT/JP2018/006698
Publication Date:
September 07, 2018
Filing Date:
February 23, 2018
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08L67/02; B29C45/14; C08K3/00; C08J5/00
Domestic Patent References:
| WO2009150831A1 | 2009-12-17 |
Foreign References:
| JP2004315805A | 2004-11-11 | |||
| JP2009149018A | 2009-07-09 |
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