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Title:
POLYCARBONATE RESIN COMPOSITION AND MOLDED BODY THEREOF
Document Type and Number:
WIPO Patent Application WO/2013/111846
Kind Code:
A1
Abstract:
A polycarbonate resin composition which contains: 100 parts by mass of a resin component that is composed of (A) 60-95% by mass of an aromatic polycarbonate resin, (B) 2-30% by mass of a polyolefin resin and/or a polyolefin elastomer, each of which contains an epoxy group or a glycidyl group and (C) 1-38% by mass of a polyolefin resin other than the component (B); and (D) a phosphorus-containing compound. In this polycarbonate resin composition, the component (D) is composed of component (D1) and/or component (D2) described below. (D1) 0.01-0.5 part by mass of at least one compound that is selected from the group consisting of phosphite compounds and phosphate compounds, wherein at least one alkoxy group is bonded to a phosphorus atom (provided that in cases where the compound has an aryloxy group bonded to a phosphorus atom, hydrogen atoms are at all the ortho positions of the aryloxy group) (D2) 0.001-0.1 part by mass of at least one acid that is selected from the group consisting of phosphoric acid, phosphorous acid, phosphonic acid and phosphonous acid

Inventors:
NAKAE MITSUGU (JP)
Application Number:
PCT/JP2013/051552
Publication Date:
August 01, 2013
Filing Date:
January 25, 2013
Export Citation:
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Assignee:
IDEMITSU KOSAN CO (JP)
NAKAE MITSUGU (JP)
International Classes:
C08L69/00; C08K3/22; C08K3/32; C08K3/34; C08K5/17; C08K5/49; C08L23/00; C08L63/00
Domestic Patent References:
WO2011078138A12011-06-30
Foreign References:
JPH05179124A1993-07-20
JP2001049104A2001-02-20
JPH08238309A1996-09-17
JP2001081302A2001-03-27
JP2012072329A2012-04-12
Attorney, Agent or Firm:
OHTANI, Tamotsu (JP)
Tamotsu Otani (JP)
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Claims: