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Title:
POLYCARBONATE RESIN COMPOSITION AND MOLDINGS THEREOF
Document Type and Number:
WIPO Patent Application WO/2005/097896
Kind Code:
A1
Abstract:
A polycarbonate resin composition which comprises 100 parts by mass of a component consisting of (A) 50 to 95 % by mass of an aromatic polycarbonate resin and (B) 5 to 50 % by mass of a silicon-containing inorganic filler, (C) 0.5 to 5 parts by mass of a phosphonium sulfonate having a specific structure and (D) 0.05 to 3 parts by mass of a phosphoric mono- or di-ester having a polyoxyalkylene alkyl ether or polyoxyalkylene aryl ether group; and moldings of the composition. The composition and the moldings are excellent in the resistance to moisture absorption as well as in mechanical strengths, flame retardance and antistatic properties.

Inventors:
NAGATOSHI KIKUO (JP)
Application Number:
PCT/JP2005/006601
Publication Date:
October 20, 2005
Filing Date:
April 04, 2005
Export Citation:
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Assignee:
IDEMITSU KOSAN CO (JP)
NAGATOSHI KIKUO (JP)
International Classes:
C08K3/34; C08K5/49; C08K5/50; C08K5/521; C08K5/5393; C08L51/04; C08L55/02; C08L69/00; C08K5/42; C08L27/18; C08L71/02; (IPC1-7): C08L69/00; C08K3/34; C08K5/5393; C08L27/18; C08L51/04; C08L71/02
Foreign References:
JP2005105206A2005-04-21
JPH1060248A1998-03-03
JP2002226697A2002-08-14
JP2000063650A2000-02-29
JPH11241010A1999-09-07
JP2002194227A2002-07-10
Attorney, Agent or Firm:
Ohtani, Tamotsu (Bridgestone Toranomon Bldg. 6F. , 25-2, Toranomon 3-chome, Minato-k, Tokyo 01, JP)
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