POLYETHYLENE FILM FOR VAPOR DEPOSITION SUBSTRATES AND VAPOR DEPOSITION FILM USING SAME

WIPO Patent Application WO/2018/163883

A1

The present invention addresses the problem of providing a polyethylene film for vapor deposition substrates, which enables the achievement of a vapor deposition film having excellent barrier properties even if the vapor deposition film is obtained by means of vapor deposition using a large-sized vapor deposition machine. A polyethylene film for vapor deposition substrates, which is used as a substrate for a vapor deposition layer, and which is characterized by comprising at least a laminate layer that serves as the vapor deposition layer-side surface and a seal layer that serves as the other surface. This polyethylene film for vapor deposition substrates is also characterized in that: the seal layer contains inorganic particles; the Mohs hardness of the inorganic particles contained in the seal layer is 3 or less; and the seal layer satisfies at least one of the requirements (i) and (ii) described below. (i) The inorganic particles contained in the seal layer have an average particle diameter of from 5 μm to 15 μm (inclusive). (ii) The three-dimensional surface roughness SRa of the sealing layer surface is 0.2 μm or less, and the maximum peak height SRmax of the sealing layer surface is 6 μm or less.

OGI HIROKAZU (JP)
OSAME SATOSHI (JP)
TANAKA HIROKI (JP)

PCT/JP2018/006946

September 13, 2018

February 26, 2018

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TOYO BOSEKI (JP)

B32B27/32; B32B27/18; C23C14/20; C23C14/14

WO2005005137A2

2005-01-20

JPH09193324A	1997-07-29
JP2015030113A	2015-02-16
JPH06270357A	1994-09-27
JPH07166328A	1995-06-27

UEKI, Kyuichi et al. (JP)

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