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Patent Searching and Data


Title:
POLYETHYLENE RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2019/093217
Kind Code:
A1
Abstract:
Provided is a polyethylene resin film which has excellent heat sealability, blocking resistance, and slipperiness, and also has excellent appearance and scratch resistance. This polyethylene resin film is characterized by comprising a polyethylene resin composition that contains particles of a polyethylene resin, and a polyethylene resin having a density of 940 kg/m3 or less, but substantially does not contain inorganic particles or organic crosslinked particles, wherein the maximum peak height of at least one surface thereof is 2-15 μm.

Inventors:
OGI, Hirokazu (LTD. 344 aza-Maehata, oaza-Kotsu, Inuyama-sh, Aichi 08, 〒4848508, JP)
NISHI, Tadashi (LTD. 344 aza-Maehata, oaza-Kotsu, Inuyama-sh, Aichi 08, 〒4848508, JP)
MATSUDA, Akira (LTD. 2-8 Dojima Hama 2-chome, Kita-ku, Osaka-sh, Osaka 30, 〒5308230, JP)
Application Number:
JP2018/040649
Publication Date:
May 16, 2019
Filing Date:
November 01, 2018
Export Citation:
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Assignee:
TOYOBO CO., LTD. (2-8 Dojima Hama 2-chome, Kita-ku Osaka-sh, Osaka 30, 〒5308230, JP)
International Classes:
C08J5/18; B32B27/32
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