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Title:
POLYGLYCOLIC ACID RESIN COMPOSITION, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2014/057969
Kind Code:
A1
Abstract:
A polyglycolic acid resin (PGA) composition which can be used as a packaging material or a material for a drilling downhole tool (member), said composition comprising 30 to 90 mass% of a PGA and 70 to 10 mass% of an inorganic filler, wherein the percentage of mass loss of the PGA after the immersion of the composition in water at a temperature of 120˚C for 3 hours is 20% or more, preferably 25% or more, and the deflection temperature under load of the composition is 120˚C or higher; and a method for producing a PGA composition, said method comprising a step of melt-kneading using an extruder.

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Inventors:
SAIGUSA KOTAKU (JP)
SUZUKI SATORU (JP)
Application Number:
PCT/JP2013/077457
Publication Date:
April 17, 2014
Filing Date:
October 09, 2013
Export Citation:
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Assignee:
KUREHA CORP (JP)
International Classes:
C08L67/04; C08J3/20; C08K3/00; C08L101/16
Foreign References:
JP2003335315A2003-11-25
JP2012149205A2012-08-09
JPH1072529A1998-03-17
JP2009540119A2009-11-19
JPH1060137A1998-03-03
JPH1060136A1998-03-03
JPH1087976A1998-04-07
JP2008260902A2008-10-30
Attorney, Agent or Firm:
NOMURA Yasuhide et al. (JP)
Yasuhide Nomura (JP)
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