Title:
POLYIMIDE COMPOUND AND MOLDED ARTICLE CONTAINING SAID POLYIMIDE COMPOUND
Document Type and Number:
WIPO Patent Application WO/2020/157953
Kind Code:
A1
Abstract:
[Problem] To provide a polyimide compound having high heat resistance and transparency. [Solution] The polyimide compound of the present invention is characterized by being the reaction product of a diamine compound represented by general formula (1) and an alicyclic tetracarboxylic dianhydride represented by general formula (2).
Inventors:
GOSHIMA TOSHIYUKI (JP)
WIN MAW SOE (JP)
WIN MAW SOE (JP)
Application Number:
PCT/JP2019/003595
Publication Date:
August 06, 2020
Filing Date:
February 01, 2019
Export Citation:
Assignee:
WINGO TECH CO LTD (JP)
International Classes:
C08G73/10; C07C229/60
Domestic Patent References:
| WO2018139311A1 | 2018-08-02 | |||
| WO2015083649A1 | 2015-06-11 | |||
| WO2017057496A1 | 2017-04-06 | |||
| WO2017051827A1 | 2017-03-30 |
Foreign References:
| JP2007112990A | 2007-05-10 | |||
| JP2012068612A | 2012-04-05 | |||
| US20150241739A1 | 2015-08-27 | |||
| JP2017013567A | 2017-01-19 |
Other References:
See also references of EP 3919548A4
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
Download PDF:
Previous Patent: PALLET CONVEYING DEVICE, COMPONENT MOUNTER, PALLET CONVEYING METHOD
Next Patent: ETCHING METHOD AND PLASMA TREATMENT DEVICE
Next Patent: ETCHING METHOD AND PLASMA TREATMENT DEVICE