Title:
POLYIMIDE-CONTAINING HEAT-RESISTANT RELEASE SHEET AND PRESSURE FORMING METHOD FOR WORK
Document Type and Number:
WIPO Patent Application WO/2022/113414
Kind Code:
A1
Abstract:
A polyimide-containing heat-resistant release sheet which comprises structural units derived from biphenyltetracarboxylic dianhydride and diaminobenzanilide, has an average thickness unevenness of 5% or less, a surface roughness Ra of 0.05 μm or less, and a tensile modulus of 6 GPa or greater, and satisfies 100×│A1-A2│/A0<0.004 (where A0 is a dimension at 25°C of the polyimide-containing heat-resistant release sheet which has not been heated, A1 is a dimension of the sheet which has been heated from 25°C to 150°C and then returned to 25°C, and A2 is a dimension of the sheet which, after the measurement of A1 dimension, has been heated again to 150°C and then returned to 25°C.)
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Inventors:
TOKUDA KAYA (JP)
OKUYAMA TETSUO (JP)
WATANABE NAOKI (JP)
YOKOYAMA MASAYUKI (JP)
YONEMUSHI HARUMI (JP)
MIZUGUCHI DENICHIROU (JP)
OKUYAMA TETSUO (JP)
WATANABE NAOKI (JP)
YOKOYAMA MASAYUKI (JP)
YONEMUSHI HARUMI (JP)
MIZUGUCHI DENICHIROU (JP)
Application Number:
PCT/JP2021/025410
Publication Date:
June 02, 2022
Filing Date:
July 06, 2021
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08J5/18; B29C43/32; C08G73/10
Foreign References:
| JP2009067859A | 2009-04-02 | |||
| JP2019528368A | 2019-10-10 | |||
| JPH02150453A | 1990-06-08 | |||
| JP2003127267A | 2003-05-08 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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