POLYIMIDE COPOLYMER AND METHODS FOR PREPARING THE SAME

Title:

POLYIMIDE COPOLYMER AND METHODS FOR PREPARING THE SAME

Document Type and Number:

WIPO Patent Application WO2003027178

Kind Code:

A3

Abstract:

The present invention relates to a polyimide copolymer used in a precursor of heat resistant adhesive and methods for preparing the same, and more particularly, to a polyamic acid copolymer and methods for preparing the same obtained by controlling a polymerization degree of the tetracarboxylic acid dianhydride and aromatic diamine. The present invention also comprises a polyimide copolymer obtained by curing the polyamic acid copolymer, and methods for preparing the same. The present invention also provides a heat resistant adhesive composition comprising the polyamic acid copolymer and the polyimide copolymer, and a semiconductor device using the same. The polyamic acid copolymer used in a precursor and polyimide copolymer obtained therefrom of the present invention has superior adhesion strength and simultaneously satisfies physical properties like high heat resistance and low water absorption rate, etc. and thus it can be effectively adhered parts of semiconductor devices, etc.

Inventors:

AHN BYEONG-IN (KR)
KYUNG YOU-JIN (KR)
KO JOO-EUN (KR)
SONG HEON-SIK (KR)

Application Number:

PCT/KR2002/001828

Publication Date:

October 23, 2003

Filing Date:

September 27, 2002

Export Citation:

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Assignee:

LG CHEMICAL LTD (KR)
AHN BYEONG-IN (KR)
KYUNG YOU-JIN (KR)
KO JOO-EUN (KR)
SONG HEON-SIK (KR)

International Classes:

C09J11/00; C08G73/10; C09J179/08; H01L21/52; (IPC1-7): C08G69/12

Foreign References:

US4258155A	1981-03-24
US4098800A	1978-07-04
JPH0955583A	1997-02-25
JPS5069196A	1975-06-09

Other References: