Title:
POLYIMIDE FILM, COPPER-CLAD LAMINATE, AND CIRCUIT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/061727
Kind Code:
A1
Abstract:
Provided is a polyimide film having a non-thermoplastic polyimide layer, wherein: the non-thermoplastic polyimide constituting the non-thermoplastic polyimide layer preferably contains at least one of a biphenyl-tetracarboxylic dianhydride (BPDA) residue derived from 3,3',4,4'-BPDA and a phenylenebis(trimellitic monoester) dianhydride (TAHQ) residue derived from 1,4-TAHQ, as well as at least one of a pyromellitic dianhydride (PMDA) residue derived from PMDA and a napthalenetetracarboxylic dianhydride (NTCDA) residue derived from 2,3,6,7-NTCDA, the total amount of these residues being at least 80 mol parts with respect to 100 mol parts of a tetracarboxylic acid residue; and the dielectric loss tangent (Df) is preferably 0.004 or less.
Inventors:
ANDO TOMONORI (JP)
NISHIYAMA TEPPEI (JP)
SUTO YOSHIKI (JP)
MORI AKIRA (JP)
NISHIYAMA TEPPEI (JP)
SUTO YOSHIKI (JP)
MORI AKIRA (JP)
Application Number:
PCT/JP2017/032642
Publication Date:
April 05, 2018
Filing Date:
September 11, 2017
Export Citation:
Assignee:
NIPPON STEEL & SUMIKIN CHEM CO (JP)
International Classes:
B32B27/34; C08G73/10; H05K1/03
Foreign References:
| JPH05271438A | 1993-10-19 | |||
| JP2011177929A | 2011-09-15 | |||
| JP2016069646A | 2016-05-09 | |||
| JP2002307608A | 2002-10-23 | |||
| JP2017165909A | 2017-09-21 | |||
| CN101121819A | 2008-02-13 |
Attorney, Agent or Firm:
WATANABE Kazuhiro (JP)
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