Title:
POLYIMIDE FILM FORMING COMPOSITION AND POLYIMIDE FILM PRODUCED BY USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/080222
Kind Code:
A3
Abstract:
The present invention provides a polyimide film forming composition which comprises a polyamic acid or a polyimide in an oligomer form or in a low-molecular weight form, the polyamic acid or the polyimide being prepared from a diamine containing an intramolecular imide group, and thus can provide a polyimide film having improved heat resistance while retaining optical properties thereof. In addition, the polyimide film according to the present invention can reduce not only a laser energy density (E/D) required in the laser exfoliation process but also remarkably decrease an amount of ash generated by an exfoliation process, thereby further improving the reliability of a device in a display manufacturing process.
Inventors:
SHIN BO RA (KR)
SUH JUN SIK (KR)
YUN CHEOLMIN (KR)
JEONG HYE WON (KR)
KIM KYUNGJUN (KR)
SUH JUN SIK (KR)
YUN CHEOLMIN (KR)
JEONG HYE WON (KR)
KIM KYUNGJUN (KR)
Application Number:
PCT/KR2017/011975
Publication Date:
November 22, 2018
Filing Date:
October 27, 2017
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08G73/10; C08J5/18
Domestic Patent References:
| WO2014168402A1 | 2014-10-16 |
Foreign References:
| US5344916A | 1994-09-06 | |||
| KR20130139872A | 2013-12-23 |
Other References:
RAGOSTA, G. ET AL.: "Polyimide/silica Hybrids via the Sol-gel Route: High Performance Materials for the New Technological Challenges", EXPRESS POLYMER LETTERS, vol. 3, no. 7, 2009, pages 413 - 428, XP055557989
DEZERN, J. F. ET AL.: "Synthesis and Characterization of Polyamide-imides", POLYMER ENGINEERING AND SCIENCE, vol. 31, no. 12, 1991, pages 860 - 866, XP055557997
DEZERN, J. F. ET AL.: "Synthesis and Characterization of Polyamide-imides", POLYMER ENGINEERING AND SCIENCE, vol. 31, no. 12, 1991, pages 860 - 866, XP055557997
Attorney, Agent or Firm:
KIM, Aera (KR)
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