POLYIMIDE FILM HAVING IMPROVED HEAT RESISTANCE AND METHOD FOR MANUFACTURING SAME

Title:

POLYIMIDE FILM HAVING IMPROVED HEAT RESISTANCE AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2017/176000

Kind Code:

A1

Abstract:

The present invention can provide a method for manufacturing a polyimide with improved thermal stability that has no contraction even at a high temperature, by adjusting the amount of an acid anhydride in the preparation of a polyimide precursor, and a polyimide film manufactured by the method causes residual stress in a substrate during a high-temperature thermal treatment procedure, thereby suppressing the occurrence of problems, such as cracks in an inorganic film or delamination of a film.

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Inventors:

HONG YE JI (KR)
KIM KYUNGJUN (KR)
PARK JINYOUNG (KR)
PARK CHAN HYO (KR)
LEE JIN HO (KR)

Application Number:

PCT/KR2017/003255

Publication Date:

October 12, 2017

Filing Date:

March 27, 2017

Export Citation:

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Assignee:

LG CHEMICAL LTD (KR)

International Classes:

C08J5/18; C08G73/10; C08L79/08

Domestic Patent References:

WO2014129464A1

2014-08-28

Foreign References:

JP2014218056A	2014-11-20
KR20110092761A	2011-08-18
KR20150040200A	2015-04-14
JP2006299196A	2006-11-02

Other References: