Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYIMIDE FILM HAVING IMPROVED THERMAL CONDUCTIVITY AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/160252
Kind Code:
A1
Abstract:
Provided according to the present invention is a substrate for a flexible display device in which the problems of threshold voltage shift-induced current fluctuation and resultant image sticking can be solved by introducing an imide monomer as an organic filler into a polyamic acid composition to enhance thickness and surface direction densities in the film that is manufactured while vulcanization is performed at high temperatures, thereby enhancing thermal diffusivity and thermal conductivity of the film.

Inventors:
KIM, Kyunghwan (LG Chem Research Park, 188 Munji-ro,Yuseong-Gu, Daejeon, 34122, KR)
JEONG, Hye Won (LG Chem Research Park, 188 Munji-ro,Yuseong-Gu, Daejeon, 34122, KR)
PARK, Chan Hyo (LG Chem Research Park, 188 Munji-ro,Yuseong-Gu, Daejeon, 34122, KR)
PARK, Jinyoung (LG Chem Research Park, 188 Munji-ro,Yuseong-Gu, Daejeon, 34122, KR)
Application Number:
KR2019/000940
Publication Date:
August 22, 2019
Filing Date:
January 23, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LG CHEM, LTD. (128 Yeoui-daero, Yeongdeungpo-Gu, Seoul, 07336, KR)
International Classes:
C08J5/18; C08G73/10; C08L79/08; G02F1/1333
Attorney, Agent or Firm:
KIM, Aera (#1301, East Bldg. 322, Teheran-ro,Gangnam-Gu, Seoul, 06211, KR)
Download PDF: