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Patent Searching and Data


Title:
POLYIMIDE FILM HAVING IMPROVED THERMAL CONDUCTIVITY AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/160252
Kind Code:
A1
Abstract:
Provided according to the present invention is a substrate for a flexible display device in which the problems of threshold voltage shift-induced current fluctuation and resultant image sticking can be solved by introducing an imide monomer as an organic filler into a polyamic acid composition to enhance thickness and surface direction densities in the film that is manufactured while vulcanization is performed at high temperatures, thereby enhancing thermal diffusivity and thermal conductivity of the film.

Inventors:
KIM KYUNGHWAN (KR)
JEONG HYE WON (KR)
PARK CHAN HYO (KR)
PARK JINYOUNG (KR)
Application Number:
KR2019/000940
Publication Date:
August 22, 2019
Filing Date:
January 23, 2019
Export Citation:
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Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08J5/18; C08G73/10; C08L79/08; G02F1/1333
Foreign References:
KR20140122677A2014-10-20
JPH0987516A1997-03-31
KR20180017561A2018-02-21
KR20190000095A2019-01-02
Other References:
PECIULYTE, L. ET AL.: "Modification of BPDA-ODA Polyimide Films by Diimides", COMPOSITE INTERFACES, vol. 17, no. 5-7, 2010, pages 453 - 465, XP055632146
OKADA, T. ET AL.: "Conformational characterization of imide compounds and polyimides using far-infrared spectroscopy and DFT calculations", POLYMER, vol. 86, 2016, pages 83 - 90, XP029438168, DOI: 10.1016/j.polymer.2016.01.037
HASEGAWA, M. ET AL.: "Structure and properties of novel asymmetric bipheny! type polyimides", HOMO-AND COPOLYMERS AND BLENDS MACROMOLECULES, vol. 32, no. 2, 1999, pages 387 - 396, XP000793359, doi:10.1021/ma9808629
Attorney, Agent or Firm:
KIM, Aera (KR)
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