POLYIMIDE FILM LAYERED BODY

Title:

POLYIMIDE FILM LAYERED BODY

Document Type and Number:

WIPO Patent Application WO/2017/188174

Kind Code:

A1

Abstract:

[Problem] To provide: a layered body which can be used as an alternative to glass, ceramics, etc., the layered body being primarily composed of a polyimide having low thermal expansion, high mechanical strength, and high heat resistance; and a method for producing the layered body. [Solution] The surface of a polyimide film is activated, and then a silane coupling agent treatment is performed. Next, the resulting silane-coupling-agent-treated polyimide film is superposed and pressurized/heated to produce a polyimide film layered body. The cross-sectional structure of the resulting polyimide film layered body is such that polyimide film layers and silane coupling agent condensate layers are alternately stacked. The bonding strength between polyimide films of this polyimide film layered body remains substantially unchanged from the initial bonding strength even after being heat-treated at 400°C for 15 minutes. This polyimide film layered body also exhibits high bending elasticity and impact strength.

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Inventors:

HARA SHOTA (JP)
TSUCHIYA TOSHIYUKI (JP)
YAMASHITA YOSHIHIRO (JP)
OKUYAMA TETSUO (JP)
WATANABE NAOKI (JP)

Application Number:

PCT/JP2017/016155

Publication Date:

November 02, 2017

Filing Date:

April 24, 2017

Export Citation:

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Assignee:

TOYO BOSEKI (JP)

International Classes:

B32B27/34; B29C65/48; B32B27/00; C08J5/12

Domestic Patent References:

WO2012141248A1	2012-10-18
WO2016031746A1	2016-03-03

Foreign References:

JPH1148423A	1999-02-23
JPS63125532A	1988-05-28
JPS63264351A	1988-11-01

Other References: