Title:
POLYIMIDE FILM FOR MANUFACTURING FLEXIBLE COPPER CLAD LAMINATE AND FLEXIBLE COPPER CLAD LAMINATE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2019/132184
Kind Code:
A1
Abstract:
The present invention provides a polyimide film and a flexible copper clad laminate comprising the same, wherein the polyimide film is prepared by the imidization of a polyamic acid derived from the polymerization of a monomer mixture comprising, at a predetermined mixing ratio, at least three kinds of aromatic dianhydride monomers and, aromatic diamine monomers including, together with para-phenylene diamine (p-PDA), a diamine having a carboxylic acid functional group and a diamine not having a carboxylic acid functional group.
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Inventors:
BACK SUNG YUL (KR)
LEE KIL NAM (KR)
LIM HYUN JAI (KR)
LEE KIL NAM (KR)
LIM HYUN JAI (KR)
Application Number:
PCT/KR2018/011398
Publication Date:
July 04, 2019
Filing Date:
September 27, 2018
Export Citation:
Assignee:
SKCKOLONPI INC (KR)
International Classes:
C08J5/18; B32B15/08; B32B15/20; C08G73/10; H05K1/03
Foreign References:
| KR20070091577A | 2007-09-11 | |||
| KR20120067645A | 2012-06-26 | |||
| KR20070090425A | 2007-09-06 | |||
| JP2001261822A | 2001-09-26 | |||
| JPH1149856A | 1999-02-23 |
Attorney, Agent or Firm:
LEE & KO IP (KR)
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