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Patent Searching and Data


Title:
POLYIMIDE FILM AND METHOD FOR MANUFACTURING POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2020/251121
Kind Code:
A1
Abstract:
The present invention relates to a polyimide film having a high elasticity and a controlled surface roughness, and a method for manufacturing a polyimide film comprising same, and provides a polyimide film obtained by the imidization reaction of a polyamic acid solution, which comprises a dianhydride component comprising a pyromellitic dianhydride (PMDA) and a diamine component composed of a diaminodiphenyl ether (ODA) and a p-phenylenediamine (PPD), wherein the amount of PPD in the diamine component is 55-60 mol%. Another aspect of the present invention provides a polyimide film in which the amount of solid part in the polyamic acid solution is 14-15 wt%.

Inventors:
KIM KI-HOON (KR)
LEE KIL-NAM (KR)
Application Number:
PCT/KR2019/013961
Publication Date:
December 17, 2020
Filing Date:
October 23, 2019
Export Citation:
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Assignee:
PI ADVANCED MAT CO LTD (KR)
International Classes:
C08G73/10; C08J5/18; C08K3/36; C08K7/18; C08L79/08; C09J7/25
Foreign References:
JP2018168358A2018-11-01
KR20040024498A2004-03-20
KR20090073136A2009-07-02
KR20150095123A2015-08-20
KR20180128828A2018-12-04
Attorney, Agent or Firm:
HANYANG PATENT FIRM (KR)
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