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Title:
POLYIMIDE LAMINATE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2017/065319
Kind Code:
A1
Abstract:
Provided are a polyimide laminate with which warping is suppressed and with which it is possible to easily and conveniently separate a resin base material, and a method for producing same. Provided is a laminate provided with a plurality of polyimide layers of, in sequence, a first polyimide layer and a second polyimide layer on a support body having a thermal expansion coefficient of 1-10 ppm/K, said polyimide laminate being characterized in that: the first polyimide layer has a film thickness of 1-50 μm, a thermal expansion coefficient that is at least the thermal expansion coefficient of the support body and is 5-30 μm, and a glass transition temperature of at least 300°C; that the second polyimide layer has a film thickness of 5-30 μm and a thermal expansion coefficient that is at least the thermal expansion coefficient of the first polyimide layer; and that the first polyimide layer and the second polyimide layer can be peeled at the interface thereof. Further provided is a method for producing the polyimide laminate in which a resin solution of a polyimide or a polyimide precursor is sequentially applied, dried, and heat-treated to form each of the polyimide layers.

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Inventors:
WANG HONGYUAN (JP)
FUJIMOTO SHIN-ETSU (JP)
HIRAISHI KATSUFUMI (JP)
YAMADA HIROAKI (JP)
Application Number:
PCT/JP2016/080758
Publication Date:
April 20, 2017
Filing Date:
October 17, 2016
Export Citation:
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Assignee:
NIPPON STEEL & SUMIKIN CHEM CO (JP)
International Classes:
B32B27/34; B05D1/38; B05D7/24
Foreign References:
JP2015525143A2015-09-03
JP2015165015A2015-09-17
JP2014115815A2014-06-26
JP2007268892A2007-10-18
JP2014061685A2014-04-10
JP2009154446A2009-07-16
JP2008246695A2008-10-16
JP2006272886A2006-10-12
JP2008068406A2008-03-27
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
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