POLYIMIDE LAYER-CONTAINING FLEXIBLE SUBSTRATE, POLYIMIDE LAYER-CONTAINING SUBSTRATE FOR FLEXIBLE SOLAR CELL, FLEXIBLE SOLAR CELL, AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2013/172355

A1

Provided is a flexible substrate which can be used for multiple purposes, which has heat resistance in that it is capable of withstanding a high temperature such as during sintering of the photoelectric conversion layer of a compound-based thin-film solar cell and with which it is possible to prevent metal penetration and diffusion in the photoelectric conversion layer. In the present invention, a polyimide layer-containing flexible substrate is obtained by forming a polyimide layer having a layer thickness of 1.5-100 µm and a glass transition point temperature of 300-450ºC on a metal substrate that is a metal foil of ordinary steel or stainless steel having a thermal expansion coefficient in the plane direction of 15 ppm/K or less, or on a metal substrate having, on the surface of a metal foil of ordinary steel or stainless steel, a metal layer formed from one selected from the group consisting of copper, nickel, zinc, and aluminum, or an alloy layer of those.

HATTORI KOUICHI (JP)
HIRAISHI KATSUFUMI (JP)
OHTA TAKUHEI (JP)
TERASHIMA SHINICHI (JP)
SUDA HIDEAKI (JP)
KUROSAKI MASAO (JP)
TANAKA MASAMOTO (JP)
NAGASAKI SHUJI (JP)
MIZUYAMA ATSUSHI (JP)

PCT/JP2013/063452

November 21, 2013

May 14, 2013

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NIPPON STEEL & SUMIKIN CHEM CO (JP)
NIPPON STEEL & SUMITOMO METAL CORP (JP)
NIPPON STEEL & SUMIKIN MAT CO (JP)

H01L31/04; B32B15/088

JP2000349311A	2000-12-15
JP2003051606A	2003-02-21
JP2012059855A	2012-03-22
JP2011165790A	2011-08-25

SATOH, TAKAHISA et al. (JP)
Takahisa Sato (JP)

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