Title:
POLYIMIDE LIGHT-SENSITIVE RESIN COMPOSITION FOR OLED
Document Type and Number:
WIPO Patent Application WO/2013/058506
Kind Code:
A2
Abstract:
The present invention relates to a polyimide light-sensitive resin composition for an OLED, and, more particularly, relates to a polyimide light-sensitive resin composition for an OLED, comprising: a) a resin comprising i) a polyamide precursor and ii) poly(hydroxy styrene) (poly hydroxy styrene); b) a 1,2-quinone diazide compound; c) a crosslinking agent; and d) a solvent. The polyimide light-sensitive resin composition according to the present invention is suitable for forming an organic insulating film of an OLED through the use of a polyimide precursor of which the molecular weight and solubility are easily adjusted.
Inventors:
KIM DONG-MYUNG (KR)
KIM BYUNG-UK (KR)
YOUN HYOC-MIN (KR)
KIM JIN-WOO (KR)
HWANG CHI-YONG (KR)
KIM BYUNG-UK (KR)
YOUN HYOC-MIN (KR)
KIM JIN-WOO (KR)
HWANG CHI-YONG (KR)
Application Number:
PCT/KR2012/008362
Publication Date:
April 25, 2013
Filing Date:
October 15, 2012
Export Citation:
Assignee:
DONGJIN SEMICHEM CO LTD (KR)
KIM DONG-MYUNG (KR)
KIM BYUNG-UK (KR)
YOUN HYOC-MIN (KR)
KIM JIN-WOO (KR)
HWANG CHI-YONG (KR)
KIM DONG-MYUNG (KR)
KIM BYUNG-UK (KR)
YOUN HYOC-MIN (KR)
KIM JIN-WOO (KR)
HWANG CHI-YONG (KR)
International Classes:
G03F7/022; G03F7/004; G03F7/039
Foreign References:
| JP2008268788A | 2008-11-06 | |||
| JP2009009934A | 2009-01-15 | |||
| KR20100124905A | 2010-11-30 | |||
| KR20110057756A | 2011-06-01 |
Attorney, Agent or Firm:
WON, YOUNG-HO (KR)
원영호 (KR)
원영호 (KR)
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Claims: