Title:
POLYIMIDE MULTILAYER BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2005/115752
Kind Code:
A1
Abstract:
Disclosed is a polyimide multilayer body wherein a thermoplastic polyimide layer is formed on at least one side of a highly heat-resistant polyimide layer. This polyimide multilayer body is characterized in that the highly heat-resistant polyimide layer contains a polyimide molecule having a reactive functional group, and the thermoplastic polyimide layer contains a thermoplastic polyimide molecule having a reactive functional group which is capable of forming at least one bond selected from an imide bond, amide bond and benzimidazole bond together with the reactive functional group of the polyimide molecule contained in the highly heat-resistant polyimide layer. By having such a constitution, the polyimide multilayer body is improved in the adhesion strength between the polyimides.
Inventors:
Yanagida, Masami (1-5-18-402, Mise Ohtsu-shi Shiga, 04, 52000, JP)
Tuji, Hiroyuki (24-7-106, Konooka Ohtsu-shi Shiga, 03, 52001, JP)
Tuji, Hiroyuki (24-7-106, Konooka Ohtsu-shi Shiga, 03, 52001, JP)
Application Number:
PCT/JP2005/009427
Publication Date:
December 08, 2005
Filing Date:
May 24, 2005
Export Citation:
Assignee:
KANEKA CORPORATION (2-4 Nakanoshima 3-chome Kita-ku, Osaka-shi Osaka, 88, 53082, JP)
Yanagida, Masami (1-5-18-402, Mise Ohtsu-shi Shiga, 04, 52000, JP)
Tuji, Hiroyuki (24-7-106, Konooka Ohtsu-shi Shiga, 03, 52001, JP)
Yanagida, Masami (1-5-18-402, Mise Ohtsu-shi Shiga, 04, 52000, JP)
Tuji, Hiroyuki (24-7-106, Konooka Ohtsu-shi Shiga, 03, 52001, JP)
International Classes:
B29C41/32; B32B27/30; B32B27/34; C08G73/10; C08G81/00; H05K1/03; (IPC1-7): B32B27/34; B29C41/32; C08G73/10; C08G81/00
Attorney, Agent or Firm:
KANEKA CORPORATION (2-4 Nakanoshima 3-chome Kita-ku, Osaka-shi, Osaka 88, 53082, JP)
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