Title:
POLYIMIDE PRECURSOR COMPOSITION FOR ENHANCING ADHESIVENESS OF POLYIMIDE FILM AND POLYIMIDE FILM MANUFACTURED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2020/091432
Kind Code:
A1
Abstract:
The present invention provides a polyimide precursor composition comprising: a polyamic acid solution prepared by polymerization of at least one type of dianhydride monomer and at least one type of diamine monomer in an organic solvent; an aromatic carboxylic acid having four or more carboxyl groups; and an antioxidant, wherein the dianhydride monomer includes an adhesive dianhydride monomer expressed by chemical formula 1. A polyimide film manufactured from the composition has an elongation of 13% or more.
Inventors:
HWANG IN HWAN (KR)
LEE IK SANG (KR)
LEE IK SANG (KR)
Application Number:
PCT/KR2019/014505
Publication Date:
May 07, 2020
Filing Date:
October 30, 2019
Export Citation:
Assignee:
SKCKOLONPI INC (KR)
International Classes:
C08G73/10; C08J5/18; C08K5/521; C08K5/5415; C08L79/08; C08L83/04; C08L83/12
Foreign References:
| KR20160125377A | 2016-10-31 | |||
| JP2006259700A | 2006-09-28 | |||
| KR20180078895A | 2018-07-10 | |||
| KR20110079810A | 2011-07-08 | |||
| JPS5735989B2 | 1982-07-31 | |||
| KR102004659B1 | 2019-10-01 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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